| Application | Micro System on Module | ||
| AI Accelerator | Hexagon 685 | ||
| System-on-Chip (SoC) | Qualcomm Snapdragon 845 | ||
| Launched | NA | ||
| Interfaces | 2 x USB 3.1, PCIe | ||
| Cores | 8 | ||
| Core Information | Cortex-A55, Cortex-A75 | ||
| Video Codec Support | h.264 | h.265 | AV1 |
| ✓ | ✓ | ✕ | |
| Number of Imagers | 2 | ||
| Max Video Resolution | 8 MP | ||
| Ethernet | ✕ | ||
| Connectivity | Cellular | Wi-Fi | Bluetooth |
| ✕ | 802.11ac | 5 | |
| Crypto Core | TrustZone® | ||
| Part Number(s) | QC-DB-P10004 | ||
| Other Notes | According to Intrinsyc, Intrinsyc’s Open-Q™ 845 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the powerful Qualcomm® Snapdragon™ SDA845 SoC, their latest and most powerful IoT chipset. With the 3rd-Gen Qualcomm® AI Platform, Spectra™ ISP, Kryo™ Octa-core CPU, Hexagon™ DSP, and a new dedicated secure processor, the 845 μSOM is ideal for powering the most advanced robotics, drones, cameras, and embedded IoT devices. In addition to the 845’s impressive processing capabilities and on-device AI powers, it also includes new and improved I/O interfaces compared to previous Snapdragon™ generations — four camera ports, two USB3.1 ports (including 4K60 DisplayPort + concurrent SS data), and a Gen3 PCIe interface. This powerful new hardware platform will be supported by your choice of full-featured Android or flexible Yocto Linux software. | ||
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